1. Advanced packaging and manufacturing technology based on adhesion engineering :
المؤلف: by Seonho Seok.
المکتبة: کتابخانه مطالعات اسلامی به زبان های اروپایی (قم)
موضوع: Microelectromechanical systems.,Microelectronic packaging.,Coatings.,Corrosion and anti-corrosives.,Engineering.,Machinery.,Manufacturing industries.,Materials science.,Nanotechnology.,TECHNOLOGY & ENGINEERING-- Mechanical.,Tools.,Tribology.
رده :
TJ241
.
S46
2018eb
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